One Report According to , Honor CEO Zhao Ming recently talked about new Honor products. He revealed that the Honor Magic V3 is in development. Ming promised that it will be an impressive and market-leading foldable phone.
He said that even after 11 months of its launch, Honor Magic V2 remains the thinnest foldable phone in the market. Ming hinted that Honor will break its own record, meaning Magic V3 may be an even thinner foldable phone than that.
Honor Magic V2 was launched in July last year. It is said to be the world’s thinnest foldable phone, measuring just 4.7mm thick. However, when folded, its thickness becomes 9.9mm which is less than most of its competitors.
It is said that the upcoming Magic V3 can be equipped with Qualcomm’s Snapdragon 8 Gen 3 processor. Previous leaks have speculated that the phone will have a 5000 mAh battery and a side facing fingerprint sensor. Magic V3 can be launched in China this July. However, the company has not yet confirmed the launch date.
Honor has launched two smartphones in India so far. It is possible that the company may also enter the foldable device market. However, this is just speculation. We should wait for official information for confirmation.